Dikhyaa Mohanty 
Odisha Chief Minister Mohan Majhi lay the foundation stone for 3D Glass Solutions Inc.’s (3DGS) cutting-edge chip packing plant at Info Valley in Bhubaneswar on Sunday, marking a major turning point for India’s aspirations in the semiconductor industry. Union Electronics and IT Minister Ashwini Vaishnaw and state Electronics and IT Minister Mukesh Mahaling both attended the function.
Speaking at the ceremony, Vaishnaw declared that a “new era of development” had begun in Odisha and commended CM Majhi’s strong commitment to industrial growth and employment creation. The goods from this unit will be the first of their kind produced in the nation, he said, describing glass substrate packaging technology as the future of the semiconductor industry.
Chief Minister Majhi described the event as a historic moment for India’s technology leadership path as well as for Odisha. Leading multinational companies like Intel, Lockheed Martin, and Applied Materials have expressed interest in Odisha, he said, pointing to the rising trust of the world in the state. He stated, “Odisha has become the first choice for investors today,” highlighting the state’s many natural resources, top-notch infrastructure, talented young, robust connectivity, and responsive governance as major benefits.
More than Rs 10,000 crore has already been allocated to semiconductor projects in Odisha, he continued, with businesses like RIR Power Electronics and SiCSEM already establishing facilities. Majhi saw Odisha as the “launchpad” for an independent India in the east, with the state taking the lead in Prime Minister Narendra Modi’s Atmanirbhar Bharat plan.
