Dikhyaa Mohanty 
Chief Minister Mohan Charan Majhi and Union Minister for Electronics & IT and Railways Ashwini Vaishnaw laid the foundation stone for a Rs 2,000-crore 3D glass substrate packaging facility in Infovally, Khordha, on Sunday, marking a significant step toward Odisha’s expansion in the semiconductor industry. Established by 3D Glass Solutions, the project is anticipated to create around 2,500 employment and establish the state as a new center for sophisticated semiconductor production in the nation.
Speaking to the crowd, Vaishnaw predicted that the facility will usher in a new phase of Odisha’s economic and technical development. He said that the facility would produce cutting-edge glass substrate packaging components for the first time in India and that the technology is a sign of the future.
The initiative marks a turning point for Odisha’s and India’s technological aspirations, according to Chief Minister Majhi. According to him, the new plant will serve developing industries including artificial intelligence, high-performance computing, and defense electronics and be the nation’s first sophisticated 3D glass substrate packaging factory.
Leading multinational corporations like Intel, Lockheed Martin, and Applied Materials are involved in the project, indicating increased trust in the state’s industrial environment, Majhi added, highlighting Odisha’s expanding attraction among international investors. He continued by saying that businesses like RIR Power Electronics and SiCSEM have already established facilities in the state, adding that over Rs 10,000 crore in investments linked to semiconductors have already been drawn to Odisha.
